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\begin{document} |
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\title{Simulating interfacial thermal conductance at metal-solvent |
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interfaces: the role of chemical capping agents} |
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\author{Shenyu Kuang and J. Daniel |
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Gezelter\footnote{Corresponding author. \ Electronic mail: gezelter@nd.edu} \\ |
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Department of Chemistry and Biochemistry,\\ |
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University of Notre Dame\\ |
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Notre Dame, Indiana 46556} |
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\date{\today} |
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\maketitle |
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\begin{doublespace} |
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\begin{abstract} |
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The abstract |
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%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%% |
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% BODY OF TEXT |
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%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%% |
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\section{Introduction} |
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The intro. |
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\section{Acknowledgments} |
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Support for this project was provided by the National Science |
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Foundation under grant CHE-0848243. Computational time was provided by |
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the Center for Research Computing (CRC) at the University of Notre |
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Dame. \newpage |
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\bibliography{interfacial} |
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\end{document} |
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