448 |
|
\begin{minipage}{\linewidth} |
449 |
|
\begin{center} |
450 |
|
\caption{Computed interfacial thermal conductivity ($G$ and |
451 |
< |
$G^\prime$) values for the Au/butanethiol/hexane interface |
452 |
< |
with united-atom model and different capping agent coverage |
453 |
< |
and solvent molecule numbers at different temperatures using a |
454 |
< |
range of energy fluxes.} |
455 |
< |
|
456 |
< |
\begin{tabular}{cccccc} |
451 |
> |
$G^\prime$) values for the 100\% covered Au-butanethiol/hexane |
452 |
> |
interfaces with UA model and different hexane molecule numbers |
453 |
> |
at different temperatures using a range of energy fluxes.} |
454 |
> |
|
455 |
> |
\begin{tabular}{cccccccc} |
456 |
|
\hline\hline |
457 |
< |
Thiol & $\langle T\rangle$ & & $J_z$ & $G$ & $G^\prime$ \\ |
458 |
< |
coverage (\%) & (K) & $N_{hexane}$ & (GW/m$^2$) & |
457 |
> |
$\langle T\rangle$ & & $L_x$ & $L_y$ & $L_z$ & $J_z$ & |
458 |
> |
$G$ & $G^\prime$ \\ |
459 |
> |
(K) & $N_{hexane}$ & \multicolumn{3}{c}\AA & (GW/m$^2$) & |
460 |
|
\multicolumn{2}{c}{(MW/m$^2$/K)} \\ |
461 |
|
\hline |
462 |
< |
0.0 & 200 & 200 & 0.96 & 43.3 & 42.7 \\ |
463 |
< |
& & & 1.91 & 45.7 & 42.9 \\ |
464 |
< |
& & 166 & 0.96 & 43.1 & 53.4 \\ |
465 |
< |
88.9 & 200 & 166 & 1.94 & 172 & 108 \\ |
466 |
< |
100.0 & 250 & 200 & 0.96 & 81.8 & 67.0 \\ |
467 |
< |
& & 166 & 0.98 & 79.0 & 62.9 \\ |
468 |
< |
& & & 1.44 & 76.2 & 64.8 \\ |
469 |
< |
& 200 & 200 & 1.92 & 129 & 87.3 \\ |
470 |
< |
& & & 1.93 & 131 & 77.5 \\ |
471 |
< |
& & 166 & 0.97 & 115 & 69.3 \\ |
472 |
< |
& & & 1.94 & 125 & 87.1 \\ |
462 |
> |
200 & 266 & 29.86 & 25.80 & 113.1 & -0.96 & |
463 |
> |
102() & 80.0() \\ |
464 |
> |
& 200 & 29.84 & 25.81 & 93.9 & 1.92 & |
465 |
> |
129() & 87.3() \\ |
466 |
> |
& & 29.84 & 25.81 & 95.3 & 1.93 & |
467 |
> |
131() & 77.5() \\ |
468 |
> |
& 166 & 29.84 & 25.81 & 85.7 & 0.97 & |
469 |
> |
115() & 69.3() \\ |
470 |
> |
& & & & & 1.94 & |
471 |
> |
125() & 87.1() \\ |
472 |
> |
250 & 200 & 29.84 & 25.87 & 106.8 & 0.96 & |
473 |
> |
81.8() & 67.0() \\ |
474 |
> |
& 166 & 29.87 & 25.84 & 94.8 & 0.98 & |
475 |
> |
79.0() & 62.9() \\ |
476 |
> |
& & 29.84 & 25.85 & 95.0 & 1.44 & |
477 |
> |
76.2() & 64.8() \\ |
478 |
|
\hline\hline |
479 |
|
\end{tabular} |
480 |
|
\label{AuThiolHexaneUA} |
505 |
|
important role in the thermal transport process across the interface |
506 |
|
in that higher degree of contact could yield increased conductance. |
507 |
|
|
508 |
< |
[ADD SIGNS AND ERROR ESTIMATE TO TABLE] |
508 |
> |
[ADD Lxyz AND ERROR ESTIMATE TO TABLE] |
509 |
|
\begin{table*} |
510 |
|
\begin{minipage}{\linewidth} |
511 |
|
\begin{center} |
512 |
|
\caption{Computed interfacial thermal conductivity ($G$ and |
513 |
< |
$G^\prime$) values for the Au/butanethiol/toluene interface at |
514 |
< |
different temperatures using a range of energy fluxes.} |
513 |
> |
$G^\prime$) values for a 90\% coverage Au-butanethiol/toluene |
514 |
> |
interface at different temperatures using a range of energy |
515 |
> |
fluxes.} |
516 |
|
|
517 |
|
\begin{tabular}{cccc} |
518 |
|
\hline\hline |
519 |
|
$\langle T\rangle$ & $J_z$ & $G$ & $G^\prime$ \\ |
520 |
|
(K) & (GW/m$^2$) & \multicolumn{2}{c}{(MW/m$^2$/K)} \\ |
521 |
|
\hline |
522 |
< |
200 & 1.86 & 180 & 135 \\ |
523 |
< |
& 2.15 & 204 & 113 \\ |
524 |
< |
& 3.93 & 175 & 114 \\ |
525 |
< |
300 & 1.91 & 143 & 125 \\ |
526 |
< |
& 4.19 & 134 & 113 \\ |
522 |
> |
200 & -1.86 & 180() & 135() \\ |
523 |
> |
& 2.15 & 204() & 113() \\ |
524 |
> |
& -3.93 & 175() & 114() \\ |
525 |
> |
300 & -1.91 & 143() & 125() \\ |
526 |
> |
& -4.19 & 134() & 113() \\ |
527 |
|
\hline\hline |
528 |
|
\end{tabular} |
529 |
|
\label{AuThiolToluene} |
571 |
|
molecules. These systems are then equilibrated and their interfacial |
572 |
|
thermal conductivity are measured with our NIVS algorithm. Table |
573 |
|
\ref{tlnUhxnUhxnD} lists these results for direct comparison between |
574 |
< |
different coverages of butanethiol. |
574 |
> |
different coverages of butanethiol. To study the isotope effect in |
575 |
> |
interfacial thermal conductance, deuterated UA-hexane is included as |
576 |
> |
well. |
577 |
|
|
578 |
< |
With high coverage of butanethiol on the gold surface, |
579 |
< |
the interfacial thermal conductance is enhanced |
580 |
< |
significantly. Interestingly, a slightly lower butanethiol coverage |
581 |
< |
leads to a moderately higher conductivity. This is probably due to |
582 |
< |
more solvent/capping agent contact when butanethiol molecules are |
583 |
< |
not densely packed, which enhances the interactions between the two |
584 |
< |
phases and lowers the thermal transfer barrier of this interface. |
577 |
< |
[COMPARE TO AU/WATER IN PAPER] |
578 |
> |
It turned out that with partial covered butanethiol on the Au(111) |
579 |
> |
surface, the derivative definition for $G$ (Eq. \ref{derivativeG}) has |
580 |
> |
difficulty to apply, due to the difficulty in locating the maximum of |
581 |
> |
change of $\lambda$. Instead, the discrete definition |
582 |
> |
(Eq. \ref{discreteG}) is easier to apply, as max($\Delta T$) can still |
583 |
> |
be well-defined. Therefore, $G$'s (not $G^\prime$) are used for this |
584 |
> |
section. |
585 |
|
|
586 |
+ |
From Table \ref{tlnUhxnUhxnD}, one can see the significance of the |
587 |
+ |
presence of capping agents. Even when a fraction of the Au(111) |
588 |
+ |
surface sites are covered with butanethiols, the conductivity would |
589 |
+ |
see an enhancement by at least a factor of 3. This indicates the |
590 |
+ |
important role cappping agent is playing for thermal transport |
591 |
+ |
phenomena on metal/organic solvent surfaces. |
592 |
|
|
593 |
< |
significant conductance enhancement compared to the gold/water |
594 |
< |
interface without capping agent and agree with available experimental |
595 |
< |
data. This indicates that the metal-metal potential, though not |
596 |
< |
predicting an accurate bulk metal thermal conductivity, does not |
597 |
< |
greatly interfere with the simulation of the thermal conductance |
598 |
< |
behavior across a non-metal interface. |
599 |
< |
The results show that the two definitions used for $G$ yield |
600 |
< |
comparable values, though $G^\prime$ tends to be smaller. |
593 |
> |
Interestingly, as one could observe from our results, the maximum |
594 |
> |
conductance enhancement (largest $G$) happens while the surfaces are |
595 |
> |
about 75\% covered with butanethiols. This again indicates that |
596 |
> |
solvent-capping agent contact has an important role of the thermal |
597 |
> |
transport process. Slightly lower butanethiol coverage allows small |
598 |
> |
gaps between butanethiols to form. And these gaps could be filled with |
599 |
> |
solvent molecules, which acts like ``heat conductors'' on the |
600 |
> |
surface. The higher degree of interaction between these solvent |
601 |
> |
molecules and capping agents increases the enhancement effect and thus |
602 |
> |
produces a higher $G$ than densely packed butanethiol arrays. However, |
603 |
> |
once this maximum conductance enhancement is reached, $G$ decreases |
604 |
> |
when butanethiol coverage continues to decrease. Each capping agent |
605 |
> |
molecule reaches its maximum capacity for thermal |
606 |
> |
conductance. Therefore, even higher solvent-capping agent contact |
607 |
> |
would not offset this effect. Eventually, when butanethiol coverage |
608 |
> |
continues to decrease, solvent-capping agent contact actually |
609 |
> |
decreases with the disappearing of butanethiol molecules. In this |
610 |
> |
case, $G$ decrease could not be offset but instead accelerated. |
611 |
|
|
612 |
+ |
A comparison of the results obtained from differenet organic solvents |
613 |
+ |
can also provide useful information of the interfacial thermal |
614 |
+ |
transport process. The deuterated hexane (UA) results do not appear to |
615 |
+ |
be much different from those of normal hexane (UA), given that |
616 |
+ |
butanethiol (UA) is non-deuterated for both solvents. These UA model |
617 |
+ |
studies, even though eliminating C-H vibration samplings, still have |
618 |
+ |
C-C vibrational frequencies different from each other. However, these |
619 |
+ |
differences in the IR range do not seem to produce an observable |
620 |
+ |
difference for the results of $G$. [MAY NEED FIGURE] |
621 |
|
|
622 |
+ |
Furthermore, results for rigid body toluene solvent, as well as other |
623 |
+ |
UA-hexane solvents, are reasonable within the general experimental |
624 |
+ |
ranges[CITATIONS]. This suggests that explicit hydrogen might not be a |
625 |
+ |
required factor for modeling thermal transport phenomena of systems |
626 |
+ |
such as Au-thiol/organic solvent. |
627 |
+ |
|
628 |
+ |
However, results for Au-butanethiol/toluene do not show an identical |
629 |
+ |
trend with those for Au-butanethiol/hexane in that $G$'s remain at |
630 |
+ |
approximately the same magnitue when butanethiol coverage differs from |
631 |
+ |
25\% to 75\%. This might be rooted in the molecule shape difference |
632 |
+ |
for plane-like toluene and chain-like {\it n}-hexane. Due to this |
633 |
+ |
difference, toluene molecules have more difficulty in occupying |
634 |
+ |
relatively small gaps among capping agents when their coverage is not |
635 |
+ |
too low. Therefore, the solvent-capping agent contact may keep |
636 |
+ |
increasing until the capping agent coverage reaches a relatively low |
637 |
+ |
level. This becomes an offset for decreasing butanethiol molecules on |
638 |
+ |
its effect to the process of interfacial thermal transport. Thus, one |
639 |
+ |
can see a plateau of $G$ vs. butanethiol coverage in our results. |
640 |
+ |
|
641 |
+ |
[NEED ERROR ESTIMATE, MAY ALSO PUT J HERE] |
642 |
|
\begin{table*} |
643 |
|
\begin{minipage}{\linewidth} |
644 |
|
\begin{center} |
645 |
< |
\caption{Computed interfacial thermal conductivity ($G$ and |
646 |
< |
$G^\prime$) values for the Au/butanethiol/hexane interface |
647 |
< |
with united-atom model and different capping agent coverage |
648 |
< |
and solvent molecule numbers at different temperatures using a |
597 |
< |
range of energy fluxes.} |
645 |
> |
\caption{Computed interfacial thermal conductivity ($G$ in |
646 |
> |
MW/m$^2$/K) values for the Au-butanethiol/solvent interface |
647 |
> |
with various UA models and different capping agent coverages |
648 |
> |
at $<T>\sim$200K using certain energy flux respectively.} |
649 |
|
|
650 |
< |
\begin{tabular}{cccccc} |
650 |
> |
\begin{tabular}{cccc} |
651 |
|
\hline\hline |
652 |
< |
Thiol & $\langle T\rangle$ & & $J_z$ & $G$ & $G^\prime$ \\ |
653 |
< |
coverage (\%) & (K) & $N_{hexane}$ & (GW/m$^2$) & |
603 |
< |
\multicolumn{2}{c}{(MW/m$^2$/K)} \\ |
652 |
> |
Thiol & & & \\ |
653 |
> |
coverage (\%) & hexane & hexane-D & toluene \\ |
654 |
|
\hline |
655 |
< |
0.0 & 200 & 200 & 0.96 & 43.3 & 42.7 \\ |
656 |
< |
& & & 1.91 & 45.7 & 42.9 \\ |
657 |
< |
& & 166 & 0.96 & 43.1 & 53.4 \\ |
658 |
< |
88.9 & 200 & 166 & 1.94 & 172 & 108 \\ |
659 |
< |
100.0 & 250 & 200 & 0.96 & 81.8 & 67.0 \\ |
660 |
< |
& & 166 & 0.98 & 79.0 & 62.9 \\ |
611 |
< |
& & & 1.44 & 76.2 & 64.8 \\ |
612 |
< |
& 200 & 200 & 1.92 & 129 & 87.3 \\ |
613 |
< |
& & & 1.93 & 131 & 77.5 \\ |
614 |
< |
& & 166 & 0.97 & 115 & 69.3 \\ |
615 |
< |
& & & 1.94 & 125 & 87.1 \\ |
655 |
> |
0.0 & 46.5 & 43.9 & 70.1 \\ |
656 |
> |
25.0 & 151 & 153 & 249 \\ |
657 |
> |
50.0 & 172 & 182 & 214 \\ |
658 |
> |
75.0 & 242 & 229 & 244 \\ |
659 |
> |
88.9 & 178 & - & - \\ |
660 |
> |
100.0 & 137 & 153 & 187 \\ |
661 |
|
\hline\hline |
662 |
|
\end{tabular} |
663 |
|
\label{tlnUhxnUhxnD} |
711 |
|
\end{table*} |
712 |
|
|
713 |
|
|
714 |
+ |
significant conductance enhancement compared to the gold/water |
715 |
+ |
interface without capping agent and agree with available experimental |
716 |
+ |
data. This indicates that the metal-metal potential, though not |
717 |
+ |
predicting an accurate bulk metal thermal conductivity, does not |
718 |
+ |
greatly interfere with the simulation of the thermal conductance |
719 |
+ |
behavior across a non-metal interface. |
720 |
+ |
|
721 |
+ |
% The results show that the two definitions used for $G$ yield |
722 |
+ |
% comparable values, though $G^\prime$ tends to be smaller. |
723 |
+ |
|
724 |
|
\subsection{Mechanism of Interfacial Thermal Conductance Enhancement |
725 |
|
by Capping Agent} |
726 |
|
[MAY INTRODUCE PROTOCOL IN METHODOLOGY/COMPUTATIONAL DETAIL] |